The active diameter is 20μm, featuring high reponsivity, low dark current, GSG structure, coplanar electrodes and pitch size is 750um.
It can be used in 5G Wireless, 100G CWDM4 and 100G LR4.
The active diameter is 50μm, featuring high reponsivity, low dark current, GS structure and coplanar electrodes.
It can be used in 10G data transmission and wireless communication.
The active diameter is 60μm, featuring high reponsivity, low dark current, low second and third order intermodulation distortion and gold-coated ground surface at the bottom side of chip.
It can be used in CATV analog optical receiver and analog video.
The active diameter is 80μm, featuring high reponsivity, low dark current, low second and third order intermodulation distortion and gold-coated ground surface at the bottom side of chip.
It can be used in CATV analog optical receiver and analog video.
The active diameter is 80μm, featuring high reponsivity, low dark current and gold-coated ground surface at the bottom side of chip.
It can be used in low-speed optical modules and FTTR.
The active diameter is 32μm, featuring high reponsivity(850nm/910nm/1310nm), low dark current, GSG structure, coplanar electrodes and pitch size is 250um.
It can be used in 400G SR4 and 800G SR4.
The side detection window 180×60μm, P/N bond pad on top, high Responsivity, low dark current.
It can be used in Side coupling, laser power monitoring and optical power meter.
The active diameter is 100μm, featuring high reponsivity, low dark current and bottom-illuminated structure.
It can be used in back facet laser power monitoring, optical power meter, etc.